Classification Details
| Category | 3 — Electronics |
| Product Group | E — Technology |
| Description | "Technology" "required" for the slicing, grinding and polishing of 300 mm diameter silicon wafers to achieve a 'Site Front least sQuares Range' ('SFQR') less than or equal to 20 nm at any site of 26 mm x 8 mm on the front surface of the wafer and an edge exclusion less than or equal to 2 mm. |
| Control Reasons | ATNS |
| License Exceptions | TSR |
Items Controlled
The list of items controlled is contained in the ECCN heading.
Related Definitions
For the purpose of 3E004, 'Site Front least sQuares Range' ('SFQR') is the range of maximum deviation and minimum deviation from front reference plane, calculated by least square method with all front surface data including site boundary within a site.
See EAR Part 772 (15 CFR 772) for complete definitions of terms used in the CCL.
Export Control Context
Category 3 covers electronics including integrated circuits, semiconductor devices, and signal processing equipment. This is one of the largest categories on the CCL. 3A001 (electronic components) and related ECCNs are frequently encountered in semiconductor and advanced manufacturing supply chains.
Source: BIS Commerce Control List, eCFR Title 15 Part 774. This reference is for informational purposes only. For licensing determinations, consult BIS.doc.gov or a licensed export compliance attorney.
Cross-Source Intelligence
Fed Reg Amendments
1
CSL Entities
1043
Recent BIS Amendments
Related Export Codes (Schedule B)
Sources: BIS Commerce Control List (eCFR), Census Schedule B, Federal Register (BIS), BIS Consolidated Screening List