Classification Details
| Category | 3 — Electronics |
| Product Group | E — Technology |
| Description | "Technology" "required" for the slicing, grinding and polishing of 300 mm diameter silicon wafers to achieve a 'Site Front least sQuares Range' ('SFQR') less than or equal to 20 nm at any site of 26 mm x 8 mm on the front surface of the wafer and an edge exclusion less than or equal to 2 mm. |
| Control Reasons | ATNS |
| License Exceptions | TSR |
Export Control Context
Category 3 covers electronics including integrated circuits, semiconductor devices, and signal processing equipment. This is one of the largest categories on the CCL. 3A001 (electronic components) and related ECCNs are frequently encountered in semiconductor and advanced manufacturing supply chains.
Source: BIS Commerce Control List, eCFR Title 15 Part 774. This reference is for informational purposes only. For licensing determinations, consult BIS.doc.gov or a licensed export compliance attorney.
Cross-Source Intelligence
Fed Reg Amendments
1
CSL Entities
1044
Recent BIS Amendments
Related Export Codes (Schedule B)
84011000008501103000
Sources: BIS Commerce Control List (eCFR), Census Schedule B, Federal Register (BIS), BIS Consolidated Screening List