Classification Details
| Category | 3 — Electronics |
| Product Group | B — Test, Inspection & Production Equipment |
| Description | Specified semiconductor manufacturing equipment as follows (see list of items controls), and "specially designed" "components" and "accessories" therefor. |
| Control Reasons | ATRS |
| License Exceptions | GBSLVS |
Items Controlled
a. [Reserved] b. Semiconductor wafer fabrication equipment for 300 mm wafers designed for ion implantation and having any of the following: b.1. Equipment designed for plasma doping, having all of the following: b.1.a. One or more Radio Frequency (RF) power source(s); b.1.b. One or more pulsed DC Power Source;
Related Controls
(1) See ECCNs 3D993 and 3E993 for associated "software" and "technology" controls. (2) For additional controls that apply to this ECCN, see also § 744.11(a)(2)(v) and § 744.23(a)(4) of the EAR.
Items may also be controlled under the ITAR (22 CFR 121) administered by the State Department Directorate of Defense Trade Controls (DDTC).
Related ECCNs
Export Control Context
Category 3 covers electronics including integrated circuits, semiconductor devices, and signal processing equipment. This is one of the largest categories on the CCL. 3A001 (electronic components) and related ECCNs are frequently encountered in semiconductor and advanced manufacturing supply chains.
Source: BIS Commerce Control List, eCFR Title 15 Part 774. This reference is for informational purposes only. For licensing determinations, consult BIS.doc.gov or a licensed export compliance attorney.
Cross-Source Intelligence
CSL Entities
1043
Related Export Codes (Schedule B)
Sources: BIS Commerce Control List (eCFR), Census Schedule B, BIS Consolidated Screening List