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Notice2014-067342014-03-27

Notice Pursuant to the National Cooperative Research and Production Act of 1993; High Density Packaging User Group International, Inc.

Justice Department, Antitrust Division

Document Excerpt

Document Headings Document headings vary by document type but may contain the following: the agency or agencies that issued and signed a document the number of the CFR title and the number of each part the document amends, proposes to amend, or is directly related to the agency docket number / agency internal file number the RIN which identifies each regulatory action listed in the Unified Agenda of Federal Regulatory and Deregulatory Actions See the Document Drafting Handbook for more details. Department of Justice Antitrust Division Notice is hereby given that, on February 27, 2014, pursuant to Section 6(a) of the National Cooperative Research and Production Act of 1993, 15 U.S.C. 4301 et seq. (“the Act”), High Density Packaging User Group International, Inc. (“HDPUG”) has filed written notifications simultaneously with the Attorney General and the Federal Trade Commission disclosing changes in its membership. The notifications were filed for the purpose of extending the Act's provisions limiting the recovery of antitrust plaintiffs to actual damages under specified circumstances. Specifically, IBM, Armonk, NY; Oracle, Redwood City, CA; Indium, Clinton, NY; ITEQ, Taoyuan, TAIWAN; Plexus, Neenah, WI; Philips Medical, Eindhoven, NETHERLANDS; Conpart, Dallas, TX; Alcatel-Lucent, Paris, FRANCE; Clariant, Muttenz, SWITZERLAND; Celestica, Toronto, CANADA; NIST (National Institute of Standards and Technology), Gaithersburg, MD; Arlon, Santa Anna, CA; Isola, Chandler, AZ; Dell, Round Rock, TX; Juniper Networks, Sunnyvale, CA; Shengyi Technologies, Guangdong, PEOPLE'S REPUBLIC OF CHINA; PWB Interconnect, Ottawa, CANADA; Sekisui, Tokyo, JAPAN; Enthone, West Haven, CT; IST, Hsinchu, TAIWAN; Kyzen, Nashville, TN; Ericsson, Kista, SWEDEN; Huawei, Shenzhen, PEOPLE'S REPUBLIC OF CHINA; Senju Metal, Tokyo, JAPAN; Akrometrix, Atlanta, GA; Hitachi Chemical, Tokyo, JAPAN; VIA System/Guangzhou, St. Louis, MO; Nabaltec, Schwandorf, GERMANY; Ciena, Hanover, MD;

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Citation: 79 FR 17182

Notice Pursuant to the National Cooperative Research and Production Act of 1993; High Density Packaging User Group International, Inc. — Federal Register 2014-06734 | Open Gov by Base